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Precision Assembly Technologies and Systems 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014 |
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Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering
Abstract : A new assembly method for silicon micro-parts with non-planar steel parts is proposed: low-temperature soldering. Existing techniques for micro-mechanical assemblies are analyzed and compared to the proposed method, the method is explained and validated on an existing product using functional tests. Performances of the reference method (adhesive bonding) are not yet fully reached, but the results are close and partially fulfil the specifications of the current production.
Cited literature [6 references]
https://hal.inria.fr/hal-01260717
Contributor : Hal Ifip <>
Submitted on : Friday, January 22, 2016 - 3:02:36 PM
Last modification on : Monday, October 2, 2017 - 4:06:04 PM
Document(s) archivé(s) le : Saturday, April 23, 2016 - 10:47:38 AM
Contributor : Hal Ifip <>
Submitted on : Friday, January 22, 2016 - 3:02:36 PM
Last modification on : Monday, October 2, 2017 - 4:06:04 PM
Document(s) archivé(s) le : Saturday, April 23, 2016 - 10:47:38 AM
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