Design of Chipless RFID Tags Printed on Paper by Flexography

Arnaud Vena 1 Etienne Perret 1 Smail Tedjini 1 Guy Eymin-Petot-Tourtollet 2 Anastasia Delattre 2 Frédéric Garet 3 Y. Boutant
1 LCIS - Laboratoire de Conception et d'Intégration des Systèmes
2 CTP - Centre Technique du Papier
3 IMEP-LAHC - Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation
Abstract : In this paper, we demonstrate for the first time that a 19-bit chipless tag based on a paper substrate can be realized using the flexography technique, which is an industrial high-speed printing process. The chipless tag is able to operate within the ultra-wide band (UWB) and has a reasonable size ( 7×3 cm 2) compared to state-of-the-art versions. Thus, it is possible to use this design for various identification applications that require a low unit cost of tags. Both the simulation and measurement results are shown, and performance comparisons are provided between several realization processes, such as classical chemical etching, flexography printing, and catalyst inkjet printing.
Keywords : paper printing radiofrequency identification chipless RFID tag flexography technique high-speed printing process paper printed RFID tag paper substrate size 3 cm size 7 cm Encoding Ink Positron emission tomography Resonant frequency Substrates Chipless RFID RFID flexography printing low cost
Type de document :
Article dans une revue
IEEE Transactions on Antennas and Propagation, Institute of Electrical and Electronics Engineers, 2013, 61 (12), pp.5868-5877. 〈10.1109/tap.2013.2281742〉
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https://hal.inria.fr/hal-01023150
Contributeur : Valence Lcis <>
Soumis le : vendredi 11 juillet 2014 - 15:13:46
Dernière modification le : vendredi 20 avril 2018 - 09:31:31

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LCIS | IMEP-LAHC | UGA | IES | UNIV-MONTPELLIER

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Arnaud Vena, Etienne Perret, Smail Tedjini, Guy Eymin-Petot-Tourtollet, Anastasia Delattre, et al.. Design of Chipless RFID Tags Printed on Paper by Flexography. IEEE Transactions on Antennas and Propagation, Institute of Electrical and Electronics Engineers, 2013, 61 (12), pp.5868-5877. 〈10.1109/tap.2013.2281742〉. 〈hal-01023150〉

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