Skip to Main content Skip to Navigation
Conference papers

Physical Design Issues in 3-D Integrated Technologies

Abstract : Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dimension. Consequently, design methodologies that efficiently handle the added complexity and inherent heterogeneity of 3-D circuits are necessary. These 3-D design methodologies should support robust and reliable 3-D circuits, while considering different forms of vertical integration, such as systems-in-package and 3-D ICs with fine grain vertical interconnections. The techniques described in this chapter address important physical design issues and fundamental interconnect structures in the 3-D design process.
Document type :
Conference papers
Complete list of metadata

Cited literature [50 references]  Display  Hide  Download
Contributor : Hal Ifip Connect in order to contact the contributor
Submitted on : Tuesday, August 5, 2014 - 5:02:04 PM
Last modification on : Thursday, March 5, 2020 - 5:40:30 PM
Long-term archiving on: : Wednesday, November 26, 2014 - 12:36:30 AM


Files produced by the author(s)


Distributed under a Creative Commons Attribution 4.0 International License



Vasilis F. Pavlidis, Eby G. Friedman. Physical Design Issues in 3-D Integrated Technologies. 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), Oct 2008, Rhodes Island, India. pp.1-21, ⟨10.1007/978-3-642-12267-5_1⟩. ⟨hal-01054273⟩



Record views


Files downloads