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Abstract : In current reconfigurable architectures, the
interconnect structures increasingly contribute to the delay and power
consumption budget. The demand for increased clock frequencies and logic
availability (smaller area foot print) makes the problem even more
important, leading among others to rapid elevation in power density.
Three-dimensional (3D) architectures are able to alleviate this problem
by accommodating a number of functional layers, each of which might be
fabricated in different technology. Since power consumption is a
critical challenge for implementing applications onto reconfigurable
hardware, a novel temperature-aware placement and routing (P&R)
algorithm targeting 3D FPGAs, is introduced. The proposed algorithm
achieves to redistribute the switched capacitance over identical
hardware resources in a rather "balanced" profile, reducing among others
the number of hotspot regions, the maximal values of power sources at
hotspots, as well as the percentage of device area that consumes high
power. For evaluation purposes, the proposed approach is realized as a
new CAD tool, named 3DPRO (3D-Placement-and-Routing-Optimization), which
is part of the complete framework, named 3D MEANDER. Comparing to
alternative solutions, the proposed one reduces the percentage of
silicon area that operates under high power by 63%, while it leads to
energy savings (about 9%), with an almost negligible penalty in
application's delay ranging from 1% up to 5%.
https://hal.inria.fr/hal-01054276 Contributor : Hal IfipConnect in order to contact the contributor Submitted on : Tuesday, August 5, 2014 - 5:02:09 PM Last modification on : Thursday, March 5, 2020 - 5:40:08 PM Long-term archiving on: : Wednesday, November 26, 2014 - 12:40:18 AM
Kostas Siozios, Dimitrios Soudris. A Temperature-Aware Placement and Routing
Algorithm Targeting 3D FPGAs. 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), Oct 2008, Rhodes Island, India. pp.211-231, ⟨10.1007/978-3-642-12267-5_12⟩. ⟨hal-01054276⟩