Abstract : The paper offers evidence on the feasibility of a
newly proposed micro-machining process, which is motivated by the need
to overcome the various limitations associated with μ-EDM and
conventional ultra-short laser micro-machining processes. The
limitations in μ-EDM and laser micro-machining processes are mainly due
to the requirement of a conductive electrode and workpiece, electrode
wear and compensation strategies, and complex process control mechanisms
respectively. The new process uses a laser beam to generate plasma in a
dielectric near the workpiece surface whose explosive expansion results
in material removal by mechanisms similar to those that occur in
μ-EDM.
Svetan Ratchev. 5th IFIP WG 5.5 International Precision Assembly Seminar (IPAS), Feb 2010, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-315, pp.73-80, 2010, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-11598-1_8〉
https://hal.inria.fr/hal-01055662
Contributeur : Hal Ifip
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Soumis le : mercredi 13 août 2014 - 12:35:09
Dernière modification le : lundi 29 janvier 2018 - 17:22:54
Document(s) archivé(s) le : jeudi 27 novembre 2014 - 00:17:00
Kumar Pallav, Kornel F. Ehmann. Feasibility of Laser Induced Plasma
Micro-machining (LIP-MM). Svetan Ratchev. 5th IFIP WG 5.5 International Precision Assembly Seminar (IPAS), Feb 2010, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-315, pp.73-80, 2010, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-11598-1_8〉. 〈hal-01055662〉
