Skip to Main content Skip to Navigation
Conference papers

Approach for the 3D-Alignment in Micro- and Nano-scale Assembly Processes

Abstract : Most assembly processes on the nano-scale take place in a Scanning Electron Microscope (SEM) for the reason of high magnification range of the microscope itself. Like all microscopes, the SEM delivers visual data just in two dimensions. This is a bottleneck for all assembly processes which require of course information of the parts to join in a third dimension. This paper shows an approach with a dedicated sensor. As an example for an assembly process a carbon nano tube (CNT) is fixed on a sharp metal tip. The sensor used detects contact between these two parts by exciting a bimorph cantilever made from piezoelectric material. It is shown that with this approach the contact is reliably detected. Recent experiments on introducing a new excitation structure show the possibility to add more dimensional testing in the same way as the one dimensional type.
Document type :
Conference papers
Complete list of metadata

Cited literature [7 references]  Display  Hide  Download
Contributor : Hal Ifip Connect in order to contact the contributor
Submitted on : Wednesday, August 13, 2014 - 11:53:01 AM
Last modification on : Friday, September 21, 2018 - 8:10:02 PM
Long-term archiving on: : Thursday, November 27, 2014 - 12:26:03 AM


Files produced by the author(s)


Distributed under a Creative Commons Attribution 4.0 International License



Thomas Wich, Christian Stolle, Manuel Mikczinski, Sergej Fatikow. Approach for the 3D-Alignment in Micro- and Nano-scale Assembly Processes. 5th IFIP WG 5.5 International Precision Assembly Seminar (IPAS), Feb 2010, Chamonix, France. pp.167-173, ⟨10.1007/978-3-642-11598-1_19⟩. ⟨hal-01055688⟩



Record views


Files downloads