Approach for the 3D-Alignment in Micro- and Nano-scale Assembly Processes

Abstract : Most assembly processes on the nano-scale take place in a Scanning Electron Microscope (SEM) for the reason of high magnification range of the microscope itself. Like all microscopes, the SEM delivers visual data just in two dimensions. This is a bottleneck for all assembly processes which require of course information of the parts to join in a third dimension. This paper shows an approach with a dedicated sensor. As an example for an assembly process a carbon nano tube (CNT) is fixed on a sharp metal tip. The sensor used detects contact between these two parts by exciting a bimorph cantilever made from piezoelectric material. It is shown that with this approach the contact is reliably detected. Recent experiments on introducing a new excitation structure show the possibility to add more dimensional testing in the same way as the one dimensional type.
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Svetan Ratchev. 5th IFIP WG 5.5 International Precision Assembly Seminar (IPAS), Feb 2010, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-315, pp.167-173, 2010, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-11598-1_19〉
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Thomas Wich, Christian Stolle, Manuel Mikczinski, Sergej Fatikow. Approach for the 3D-Alignment in Micro- and Nano-scale Assembly Processes. Svetan Ratchev. 5th IFIP WG 5.5 International Precision Assembly Seminar (IPAS), Feb 2010, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-315, pp.167-173, 2010, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-11598-1_19〉. 〈hal-01055688〉

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