Microstrip transmission lines and antennas on Molded Interconnect Devices materials

Abstract : In this paper, microstrip transmission lines and antennas realized on Molded Interconnect Devices (MIDs) are presented. Measurements of two transmission lines realized by LDS on LCP vectra E820i substrate and inkjet printing on ABS PC substrates allowed the extraction of LCP vectra E820i and ABS PC permittivities. Measurement results show that lower losses are obtained with the LDS fabrication technique, validating thus the potential of MIDs for RF applications. The measurement results of the two microstrip patch antennas realized by Laser Direct structuring (LDS) on LCP vectra E820i substrate and inkjet printing on ABS PC substrate are made in good agreement with simulations.
Type de document :
Communication dans un congrès
IEEE. Mediterranean Microwave Symposium (MMS), 2013 13th, Sep 2013, Unknown, pp.1-4, 2013, 〈10.1109/mms.2013.6663072〉
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https://hal.inria.fr/hal-01056736
Contributeur : Valence Lcis <>
Soumis le : mercredi 20 août 2014 - 14:28:59
Dernière modification le : mardi 9 octobre 2018 - 15:56:05

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Divya Unnikrishnan, Darine Kaddour, Smail Tedjini. Microstrip transmission lines and antennas on Molded Interconnect Devices materials. IEEE. Mediterranean Microwave Symposium (MMS), 2013 13th, Sep 2013, Unknown, pp.1-4, 2013, 〈10.1109/mms.2013.6663072〉. 〈hal-01056736〉

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