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Microstrip transmission lines and antennas on Molded Interconnect Devices materials

Divya Unnikrishnan 1 Darine Kaddour 1 Smail Tedjini 1
1 LCIS - Laboratoire de Conception et d'Intégration des Systèmes
Abstract : In this paper, microstrip transmission lines and antennas realized on Molded Interconnect Devices (MIDs) are presented. Measurements of two transmission lines realized by LDS on LCP vectra E820i substrate and inkjet printing on ABS PC substrates allowed the extraction of LCP vectra E820i and ABS PC permittivities. Measurement results show that lower losses are obtained with the LDS fabrication technique, validating thus the potential of MIDs for RF applications. The measurement results of the two microstrip patch antennas realized by Laser Direct structuring (LDS) on LCP vectra E820i substrate and inkjet printing on ABS PC substrate are made in good agreement with simulations.
Keywords : ink jet printing microstrip antennas permittivity transmission lines ABS PC permittivity ABS PC substrate LCP vectra E820i substrate LDS fabrication technique MID RF application inkjet printing laser direct structuring microstrip patch antenna microstrip transmission line molded interconnect device Antenna measurements Microstrip Power transmission lines Printing Substrates Transmission line measurements Antennas Conductive losses Laser Direct Structuring (LDS) Microstrip line Molded Interconnect Device (MID)
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Conference papers
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https://hal.inria.fr/hal-01056736
Contributor : Valence Lcis <>
Submitted on : Wednesday, August 20, 2014 - 2:28:59 PM
Last modification on : Friday, November 6, 2020 - 4:37:46 AM

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LCIS | UNIV-MONTPELLIER | UGA

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Divya Unnikrishnan, Darine Kaddour, Smail Tedjini. Microstrip transmission lines and antennas on Molded Interconnect Devices materials. Mediterranean Microwave Symposium (MMS), 2013 13th, Sep 2013, Unknown, pp.1-4, ⟨10.1109/mms.2013.6663072⟩. ⟨hal-01056736⟩

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