Experimental Evaluation of Differential Chip-to-Antenna Bondwire Interconnects above 110 GHz

Václav Valenta 1, * Hermann Schumacher 1 Thomas Spreng 2 Volker Ziegler 2 Dragos Dancila 3 Anders Rydberg 3
* Auteur correspondant
1 Ulm University
2 Airbus Group [Germany]
3 Uppsala University
Abstract : Bondwire interconnects for differential chip-to-antenna interfaces are investigated. Two different compensation structures for different interconnect lengths are designed and evaluated using dedicated transmit and receive BiCMOS modules operating across a 110 to 156 GHz band. Measurement results demonstrate that a 9 GHz bandwidth and a minimum insertion loss of 0.2 dB can be achieved for interconnects as long as 0.8 mm, showing that the well established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility of the proposed solution is assessed as well.
Keywords : bondwire interconnect wire-bonding MMIC
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Communication dans un congrès
The 44th European Microwave Conference, Oct 2014, Rome, Italy
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Václav Valenta, Hermann Schumacher, Thomas Spreng, Volker Ziegler, Dragos Dancila, et al.. Experimental Evaluation of Differential Chip-to-Antenna Bondwire Interconnects above 110 GHz. The 44th European Microwave Conference, Oct 2014, Rome, Italy. 〈hal-01076078〉

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