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Experimental Evaluation of Differential Chip-to-Antenna Bondwire Interconnects above 110 GHz
Abstract : Bondwire interconnects for differential chip-to-antenna interfaces are investigated. Two different compensation structures for different interconnect lengths are designed and evaluated using dedicated transmit and receive BiCMOS modules operating across a 110 to 156 GHz band. Measurement results demonstrate that a 9 GHz bandwidth and a minimum insertion loss of 0.2 dB can be achieved for interconnects as long as 0.8 mm, showing that the well established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility of the proposed solution is assessed as well.
Cited literature [14 references]
https://hal.inria.fr/hal-01076078
Contributor : Vaclav Valenta <>
Submitted on : Tuesday, October 21, 2014 - 10:42:39 AM
Last modification on : Monday, March 4, 2019 - 1:52:58 PM
Long-term archiving on: : Friday, April 14, 2017 - 12:09:07 PM
Contributor : Vaclav Valenta <>
Submitted on : Tuesday, October 21, 2014 - 10:42:39 AM
Last modification on : Monday, March 4, 2019 - 1:52:58 PM
Long-term archiving on: : Friday, April 14, 2017 - 12:09:07 PM
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eumw_2014_valenta.pdf
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