Abstract : A new assembly method for silicon micro-parts with non-planar steel parts is proposed: low-temperature soldering. Existing techniques for micro-mechanical assemblies are analyzed and compared to the proposed method, the method is explained and validated on an existing product using functional tests. Performances of the reference method (adhesive bonding) are not yet fully reached, but the results are close and partially fulfil the specifications of the current production.
Svetan Ratchev. 7th International Precision Assembly Seminar (IPAS), Feb 2014, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-435, pp.8-14, 2014, Precision Assembly Technologies and Systems. 〈10.1007/978-3-662-45586-9_2〉
https://hal.inria.fr/hal-01260717
Contributeur : Hal Ifip
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Soumis le : vendredi 22 janvier 2016 - 15:02:36
Dernière modification le : lundi 2 octobre 2017 - 16:06:04
Document(s) archivé(s) le : samedi 23 avril 2016 - 10:47:38
Laurenz Notter, Jacques Jacot. Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering. Svetan Ratchev. 7th International Precision Assembly Seminar (IPAS), Feb 2014, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-435, pp.8-14, 2014, Precision Assembly Technologies and Systems. 〈10.1007/978-3-662-45586-9_2〉. 〈hal-01260717〉
