K. Hecker, Organic and Printed Electronics, Frankfurt am Main, vol.3, 2009.

J. Gourlay, Light-Rolls: High throughput manufacture for LED Lighting and Displays. Display Week, Digest of Technical Papers, 2010.

C. J. Morris, S. A. Stauth, and B. A. Parviz, Self-assembly for microscale and nanoscale packaging: steps toward self-packaging, IEEE Transactions on Advanced Packaging, vol.28, issue.4, pp.600-611, 2005.
DOI : 10.1109/TADVP.2005.858454

. Fang and K. F. Böhringer, Wafer-Level Packaging Based on Uniquely Orienting Self-Assembly (The DUO-SPASS Process), Journal of Microelectromechanical Systems, vol.15, issue.3, 2006.

H. J. Yeh and J. S. Smith, Fluidic Slef-Assembly for the Integration of GaAs Light-Emitting Diodes on Si Substrates, IEEE Photonics Technology Letters, vol.6, issue.6, 1994.

D. Schlenker, Schließventillösung für unterschiedlichste Anwendungen, adhäsion KLEBEN & DICHTEN, issue.11, pp.16-18, 2010.