J. D. Claverley, A. Burisch, R. K. Leach, A. Raatz-design, and .. , Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench, p.17

J. F. Van-gurp, M. Tichem, and U. , Staufer Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment, p.28

J. Taprogge, F. Beyeler, A. Steinecker, and J. Bradley, Nelson Processes for the Self-assembly of Micro Parts, p.36

M. Burgard, N. Schläfli, and .. , Uwe Mai Precisely Assembled Multi Deflection Arrays ? Key Components for Multi Shaped Beam Lithography, p.42

M. Mohaupt, E. Beckert, T. Burkhardt, M. Hornaff, C. Damm et al., Hans-Joachim Döring, and Klaus Reimer Handling and Manipulation in Assembly Construction Kit for Miniaturised Handling Systems: Further Developments and First, p.51

A. Hoch, M. Haag, and S. , Härer Flexible Gripper System for Small Optical Assemblies ? Final Tests and Findings, p.57

T. Prusi, R. Heikkilä, T. H. Ha, J. Y. Song, C. W. et al., Lee, and Reijo Tuokko X Table of Contents Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments, p.65

C. Belly and M. Bagot, and Frank Claeyssen Tolerance Management and Error Compensation Methods Tolerance Management for Assembly ? Not a Matter of Product Size, p.97

R. Müller, M. Esser, C. Janßen, and -. , Matthias Vette, and Stefan Quinders Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro, p.105

A. Rugbani and K. , Schreve Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach, 118 Christian Löchte, Jamal Kayasa, Christoph Herrmann, and Annika Raatz Metrology and Quality Control Accuracy Measurements of Miniature Robot Using Optical CMM . . . . . . 126

R. Lafeber, G. Van-den-bosch, M. Murre, and J. Bassa, Leo van Moergestel, and Erik Puik Table of Contents XI Intelligent Control of Assembly Systems Towards Intelligent Assembly and Manufacturing Environment ? Modular ICT Support for, Holonic Manufacturing System, p.154

M. Lanz, E. Järvenpää, P. Luostarinen, and F. Garcia, and Reijo Tuokko Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data, p.163

K. Konrad, M. Hoffmeister, and M. Zapp, Alexander Verl, and Johannes Busse Accelerated Ramp-Up of Assembly Systems through Self-learning, p.175

R. Oates, D. Scrimieri, and .. , and Svetan Ratchev Process Selecting and Modelling Techniques A Methodology for Assessing the Cost Effectiveness of Assembly Processes, p.183

D. Zdebski, S. Afazov, and .. , Svetan Ratchev, and Joel Segal Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities