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Conference papers

On the Co-simulation of SystemC with QEMU and OVP Virtual Platforms

Abstract : Virtual prototyping allows designers to set up an electronic system level software simulator of a full HW/SW platform to carry out SW development and HW design almost in parallel. To achieve the goal virtual prototyping tools allow the co-simulation between an efficient instruction set simulator, mainly based on dynamic binary translation of the target code, and simulation kernels for HW models, described by means of traditional hardware description languages, like, for example, SystemC. In this context, some approaches have been proposed for co-simulation between QEMU and SystemC, both from EDA companies and academic research groups. On the contrary, no paper addresses integration between Open Virtual Platform (OVP) and SystemC. Indeed, OVP models and the related simulator can be integrated into SystemC designs by using TLM 2.0 wrappers and opportune OVP APIs. However, this solution presents some disadvantages, like the incapability of supporting cycle-accurate models, and the necessity of re-design, in terms of SystemC modules, all OVP components that should be integrated in the target platform. To avoid such drawbacks, and provide an easy way to port SystemC models from a QEMU-based to an OVP-based virtual platform and vice versa, this paper presents a common co-simulation approach that works for integrating SystemC components with both QEMU and OVP. Experimental results show the effectiveness of the proposed architecture.
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Submitted on : Wednesday, October 19, 2016 - 10:47:00 AM
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Alessandro Lonardi, Graziano Pravadelli. On the Co-simulation of SystemC with QEMU and OVP Virtual Platforms. 22th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC 2014), Oct 2014, Playa del Carmen, Mexico. pp.110-128, ⟨10.1007/978-3-319-25279-7_7⟩. ⟨hal-01383732⟩



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