Skip to Main content Skip to Navigation
Conference papers

Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics

Abstract : Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.
Document type :
Conference papers
Complete list of metadata

Cited literature [13 references]  Display  Hide  Download
Contributor : Hal Ifip Connect in order to contact the contributor
Submitted on : Monday, October 24, 2016 - 11:29:29 AM
Last modification on : Thursday, March 5, 2020 - 4:42:06 PM


Files produced by the author(s)


Distributed under a Creative Commons Attribution 4.0 International License



Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura. Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics. 11th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2014, Yokohama, Japan. pp.237-246, ⟨10.1007/978-3-662-45937-9_24⟩. ⟨hal-01386503⟩



Record views


Files downloads