Abstract : Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.
Shuichi Fukuda; Alain Bernard; Balan Gurumoorthy; Abdelaziz Bouras. 11th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2014, Yokohama, Japan. Springer, IFIP Advances in Information and Communication Technology, AICT-442, pp.237-246, 2014, Product Lifecycle Management for a Global Market. 〈10.1007/978-3-662-45937-9_24〉
https://hal.inria.fr/hal-01386503
Contributeur : Hal Ifip
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Soumis le : lundi 24 octobre 2016 - 11:29:29
Dernière modification le : vendredi 1 décembre 2017 - 01:15:49
Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura. Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics. Shuichi Fukuda; Alain Bernard; Balan Gurumoorthy; Abdelaziz Bouras. 11th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2014, Yokohama, Japan. Springer, IFIP Advances in Information and Communication Technology, AICT-442, pp.237-246, 2014, Product Lifecycle Management for a Global Market. 〈10.1007/978-3-662-45937-9_24〉. 〈hal-01386503〉
