Interlayer cooling potential in vertically integrated packages, Microsystem Technologies, vol.2, issue.1, 2008. ,
DOI : 10.1007/s00542-008-0690-4
IBM Cools 3D Chips With Integrated Water Channels ,
Dynamic thermal management in 3D multicore architectures, 2009 Design, Automation & Test in Europe Conference & Exhibition, 2009. ,
DOI : 10.1109/DATE.2009.5090885
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.454.6726
Modeling and dynamic management of 3D multicore systems with liquid cooling, 2009 17th IFIP International Conference on Very Large Scale Integration (VLSI-SoC), 2009. ,
DOI : 10.1109/VLSISOC.2009.6041327
Temperature-aware microarchitecture, International Symposium on Computer Architecture (ISCA), 2003. ,
DOI : 10.1109/isca.2003.1206984
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.135.9559
Ic thermal simulation and modeling via efficient multigrid-based approaches. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, vol.25, issue.9, pp.1763-1776, 2006. ,
Thermal-adi -a linear-time chip-level dynamic thermalsimulation algorithm based on alternating-direction-implicit (adi) method. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, vol.11, issue.4, pp.691-700, 2003. ,
Isac: Integrated space-and-timeadaptive chip-package thermal analysis. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, vol.26, issue.1, pp.86-99, 2007. ,
DOI : 10.1109/tcad.2006.882589
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.461.3510
A fast HW/SW FPGA-based thermal emulation framework for multiprocessor system-on-chip, Design Automation Conference (DAC), 2006. ,
DOI : 10.1109/dac.2006.229307
Analytical model for sensor placement on microprocessors, Computer Design: VLSI in Computers and Processors, 2005. ICCD 2005. Proceedings. 2005 IEEE International Conference on, pp.24-27, 2005. ,
Systematic temperature sensor allocation and placement for microprocessors, Proceedings of the 43rd annual conference on Design automation , DAC '06, pp.542-547, 2006. ,
DOI : 10.1145/1146909.1147051
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.214.9922
Hotspot-limited microprocessors: Direct temperature and power distribution measurements . Solid-State Circuits, IEEE Journal, vol.42, issue.1, pp.56-65, 2007. ,
DOI : 10.1109/jssc.2006.885064
Power model validation through thermal measurements, ACM SIGARCH Computer Architecture News, vol.35, issue.2, pp.302-311, 2007. ,
DOI : 10.1145/1273440.1250700
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.115.7319
Dynamic thermal management for high-performance microprocessors, Proceedings HPCA Seventh International Symposium on High-Performance Computer Architecture, pp.171-182, 2001. ,
DOI : 10.1109/HPCA.2001.903261
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.115.4549
Reducing power density through activity migration, Proceedings of the 2003 international symposium on Low power electronics and design , ISLPED '03, pp.217-222, 2003. ,
DOI : 10.1145/871506.871561
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.586.7989
HybDTM, Proceedings of the 43rd annual conference on Design automation , DAC '06, pp.548-553, 2006. ,
DOI : 10.1145/1146909.1147052
Techniques for Multicore Thermal Management, International Symposium on Computer Architecture (ISCA), 2006. ,
DOI : 10.1145/1150019.1136493
Understanding the Thermal Implications of Multi-Core Architectures, IEEE Transactions on Parallel and Distributed Systems, vol.18, issue.8, pp.1055-1065, 2007. ,
DOI : 10.1109/TPDS.2007.1092
Static and Dynamic Temperature-Aware Scheduling for Multiprocessor SoCs, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.16, issue.9, pp.1127-1140, 2008. ,
DOI : 10.1109/TVLSI.2008.2000726
CMP Design Space Exploration Subject to Physical Constraints, The Twelfth International Symposium on High-Performance Computer Architecture, 2006., pp.17-28, 2006. ,
DOI : 10.1109/HPCA.2006.1598109
Design space exploration for multicore architectures, Proceedings of the 20th annual international conference on Supercomputing , ICS '06, pp.177-186, 2006. ,
DOI : 10.1145/1183401.1183428
Many-core design from a thermal perspective, Proceedings of the 45th annual conference on Design automation, DAC '08, pp.746-749, 2008. ,
DOI : 10.1145/1391469.1391660
Three-dimensional integrated circuits, IBM Journal of Research and Development, vol.50, issue.4.5, pp.491-506, 2006. ,
DOI : 10.1147/rd.504.0491
Fabrication technologies for threedimensional integrated circuits, Tezzaron: 3D IC industry summary 3D IC Summary.html [26] Samsung Proceedings. International Symposium on, pp.33-37, 2002. ,
Three-dimensional cache design exploration using 3dcacti, ICCD '05: Proceedings of the 2005 International Conference on Computer Design, pp.519-524, 2005. ,
3d-stacked memory architectures for multi-core processors, ISCA '08: Proceedings of the 35th International Symposium on Computer Architecture, pp.453-464, 2008. ,
DOI : 10.1145/1394608.1382159
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.121.9460
Implementing caches in a 3D technology for high performance processors, 2005 International Conference on Computer Design, pp.525-532, 2005. ,
DOI : 10.1109/ICCD.2005.65
Thermal analysis of a 3D die-stacked highperformance microprocessor, Proceedings of GLSVLSI, 2006. ,
Multi-layers with buried structures (mlbs): an approach to three-dimensional integration, IEEE International, pp.117-118, 2001. ,
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.26, issue.1, 2007. ,
DOI : 10.1109/TCAD.2006.883925
Integrating dynamic thermal via planning with 3D floorplanning algorithm, Proceedings of the 2006 international symposium on Physical design , ISPD '06, pp.178-185, 2006. ,
DOI : 10.1145/1123008.1123048
Three-dimensional chipmultiprocessor run-time thermal management, IEEE Transactions on CAD, vol.27, issue.8, pp.1479-1492, 2008. ,
High-performance heat sinking for VLSI, IEEE Electron Device Letters, vol.2, issue.5, pp.126-129, 1981. ,
DOI : 10.1109/EDL.1981.25367
Direct liquid-jet impingement cooling with micron-sized nozzle array and distributed return architecture, In: ITHERM, 2006. ,
DOI : 10.1109/itherm.2006.1645343
High heat flux cooling solutions for thermal management of high power density gallium nitride HEMT, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004. ,
DOI : 10.1109/ITHERM.2004.1318255
Package embedded heat exchanger for stacked multi-chip module, Sensors and Actuators A: Physical, vol.114, issue.2-3, 2003. ,
DOI : 10.1016/j.sna.2003.12.026
The impact of liquid cooling on 3D multi-core processors, 2009 IEEE International Conference on Computer Design, 2009. ,
DOI : 10.1109/ICCD.2009.5413115
12 volt DC pumps datasheets ,
Proactive temperature balancing for low cost thermal management in MPSoCs, 2008 IEEE/ACM International Conference on Computer-Aided Design, pp.250-257, 2008. ,
DOI : 10.1109/ICCAD.2008.4681582
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.459.5352
Sequential probability ratio test for nuclear plant component surveillance, Nuclear Technology, vol.93, issue.2, pp.131-137, 1991. ,
A power-efficient high-throughput 32-thread SPARC processor, International Solid-State Circuits Conference (ISSCC), 2006. ,
DOI : 10.1109/isscc.2006.1696060
Solaris Performance and Tools, 2006. ,
Full chip leakage estimation considering power supply and temperature variations, Proceedings of the 2003 international symposium on Low power electronics and design , ISLPED '03, 2003. ,
DOI : 10.1145/871506.871529
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.72.4614