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An Analytical Model of Temperature in Microprocessors

Pierre Michaud 1 Yiannakis Sazeides 2 André Seznec 1 Theofanis Constantinou 2 Damien Fetis 1
1 CAPS - Compilation, parallel architectures and system
IRISA - Institut de Recherche en Informatique et Systèmes Aléatoires, Inria Rennes – Bretagne Atlantique
Abstract : Temperature has become an important design constraint for high-performance microprocessors. Research on temperature-constrained microarchitecture requires an efficient modeling of temperature. We propose an analytical model of temperature, based on solving a boundary-value problem of heat conduction. The model gives steady-state and transient temperature at any point on the dissipating plane, assuming rectangle-shaped surface sources. The model can be used to reason about temperature. It can also be implemented in a performance/power microarchitecture simulator. We provide two examples illustrating these uses.
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Submitted on : Friday, May 19, 2006 - 7:50:36 PM
Last modification on : Friday, February 4, 2022 - 3:23:24 AM
Long-term archiving on: : Sunday, April 4, 2010 - 8:48:29 PM


  • HAL Id : inria-00070275, version 1


Pierre Michaud, Yiannakis Sazeides, André Seznec, Theofanis Constantinou, Damien Fetis. An Analytical Model of Temperature in Microprocessors. [Research Report] RR-5744, INRIA. 2005, pp.32. ⟨inria-00070275⟩



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