STiMuL: a Software for Modeling Steady-State Temperature in Multilayers - Description and user manual
Résumé
This report describes STiMuL, a model and software for steady-state temperature in multilayers. STiMuL is primarily intended for modeling steady-state heat conduction in microprocessors and their packaging. STiMuL can be used to model temperature in 2D and 3D circuits from 2D power density maps provided by the user. It can also be used to obtain power density maps from temperature maps. The STiMuL software is publicly available. This report describes the theoretical model and its software implementation. It explains how to use the software and provides some examples of utilization.
Origine : Fichiers produits par l'(les) auteur(s)
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