J. Albers, An exact recursion relation solution for the steady-state surface temperature of a general multilayer structure, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.18, issue.1, pp.31-38, 1995.
DOI : 10.1109/95.370732

P. Antognetti, G. R. Bisio, F. Curatelli, and S. Palara, Three-dimensional transient thermal simulation: application to delayed short circuit protection in power ICs, IEEE Journal of Solid-State Circuits, vol.15, issue.3, pp.15277-281, 1980.
DOI : 10.1109/JSSC.1980.1051383

W. Batty, C. E. Christoffersen, A. J. Panks, S. David, C. M. Snowden et al., Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems, IEEE Transactions on Components and Packaging Technologies, vol.24, issue.4, pp.566-590, 2001.
DOI : 10.1109/6144.974944

D. H. Chien, C. Y. Wang, and C. C. Lee, Temperature solution o f five-layer structure with an embedded circular source, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 1992.
DOI : 10.1109/ITHERM.1992.187759

J. R. Culham, M. M. Yovanovich, and T. F. Lemczyk, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution, Journal of Electronic Packaging, vol.122, issue.3, pp.233-239, 2000.
DOI : 10.1115/1.1287928

J. Dorkel, P. Tounsi, and P. Leturcq, Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.19, issue.4, pp.501-507, 1996.
DOI : 10.1109/95.554931

G. N. Ellison, The effect of some composite structures on the thermal resistance of substrates and integrated circuit chips, IEEE Transactions on Electron Devices, vol.20, issue.3, pp.20233-238, 1973.
DOI : 10.1109/T-ED.1973.17634

M. Frigo and S. G. Johnson, The Design and Implementation of FFTW3, Proceedings of the IEEE, pp.216-231, 2005.
DOI : 10.1109/JPROC.2004.840301

H. F. Hamann, J. Lacey, A. Weger, and J. Wakil, Spatially-Resolved Imaging of Microprocessor Power (SIMP): Hotspots in Microprocessors, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., 2006.
DOI : 10.1109/ITHERM.2006.1645331

H. F. Hamann, A. Weger, J. A. Lacey, Z. Hu, P. Bose et al., Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements, IEEE Journal of Solid-State Circuits, vol.42, issue.1, pp.56-65, 2007.
DOI : 10.1109/JSSC.2006.885064

A. G. Kokkas, Thermal analysis of multiple-layer structures, IEEE Transactions on Electron Devices, vol.21, issue.11, pp.674-681, 1974.
DOI : 10.1109/T-ED.1974.17993

C. C. Lee, J. Min, and A. L. Palisoc, An integration algorithm for the temperature solution of the four-layer infinite plate structure, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, 1989.
DOI : 10.1109/STHERM.1989.76065

P. Leturcq, J. Dorkel, A. Napieralski, and E. Lachiver, A new approach to thermal analysis of power devices, IEEE Transactions on Electron Devices, vol.34, issue.5, pp.341147-1156, 1987.
DOI : 10.1109/T-ED.1987.23057

D. Maillet, S. André, J. C. Batsale, A. Degiovanni, and C. Moyne, Thermal quadrupoles -Solving the heat equation through integral transforms, 2000.

Y. J. Min, A. L. Palisoc, and C. C. Lee, Transient thermal study of semiconductor devices, Proceedings of the 6th SEMI-THERM Symposium, 1990.

]. M. Ozis¸ikozis¸ik, Boundary value problems of heat conduction, 1968.

N. Rinaldi, Generalized image method with application to the thermal modeling of power devices and circuits, IEEE Transactions on Electron Devices, vol.49, issue.4, pp.679-686, 2002.
DOI : 10.1109/16.992879

B. Wang and P. Mazumder, Fast thermal analysis for VLSI circuits via semi-analytical Green's function in multi-layer materials, Proceedings of the International Symposium on Circuits and Systems, 2004.

B. Wang and P. Mazumder, Accelerated Chip-Level Thermal Analysis Using Multilayer Green's Function, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.26, issue.2, pp.325-344, 2007.
DOI : 10.1109/TCAD.2006.883919

K. Xiu and M. Ketchen, Thermal modeling of a small extreme power density macro on a high power density microprocessor chip in the presence of realistic packaging and interconnect structures, Proceedings of the Electronic Components and Technology Conference, 2004.

K. Xiu and M. Ketchen, Generalized thermal analysis of hotspots on a high power density microprocessor chip, Proceedings of the Electronic Components and Technology Conference, 2005.

Y. Zhan and S. S. Sapatnekar, Fast computation of the temperature distribution in VLSI chips using the discrete cosine transform and table look-up, Proceedings of the 2005 conference on Asia South Pacific design automation , ASP-DAC '05, 2005.
DOI : 10.1145/1120725.1120753

Y. Zhan and S. S. Sapatnekar, A high efficiency full-chip thermal simulation algorithm, Proceedings of the International Conference on Computer-Aided Design, 2005.