Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment

Abstract : Packaging is one of the major cost drivers for MEMS devices. Currently wire bonding is the dominant method for electrically connecting MEMS chips to substrate. Using self-alignment a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The Controlled Collapse Re-flow Chip Joining (C-4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study force sensors have been packaged. Precise angular alignment of the sensors is critical for receiving accurate measurements. Results of the case study are presented.
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Svetan Ratchev. 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-371, pp.28-35, 2012, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-28163-1_4〉
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Jens Taprogge, Felix Beyeler, Alexander Steinecker, Bradley Nelson. Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment. Svetan Ratchev. 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-371, pp.28-35, 2012, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-28163-1_4〉. 〈hal-01363876〉

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