Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System

Abstract : This paper discusses the possibilities of a modular and more transparent knowledge management concept for a holonic assembly and manufacturing environment that enhances representation of past and present status of the production system thus allowing autonomous reasoning to be applied. The modular ICT approach is developed for a holonic manufacturing system (HMS). The main characteristics of the system are that it is an open system and has characteristics of a complex system. The system itself is an adaptive system, where different services are needed depending on theevolution of the production system itself. The research approach represented here aims to enhance knowledge management and process control by facilitating the move from technology based solutions to conÞgurable systems and processes where the digital models and modular knowledge management systems can be conÞgured based on the need - not based on the closed legacy systems and Þxed process planning. The principles of modularization such as functionalities and interfaces, are used to deal with interactions of the full system.
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Svetan Ratchev. 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-371, pp.154-162, 2012, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-28163-1_19〉
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Minna Lanz, Eeva Järvenpää, Pasi Luostarinen, Fernando Garcia, Reijo Tuokko. Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System. Svetan Ratchev. 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. Springer, IFIP Advances in Information and Communication Technology, AICT-371, pp.154-162, 2012, Precision Assembly Technologies and Systems. 〈10.1007/978-3-642-28163-1_19〉. 〈hal-01363896〉

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